In the Plasma-to-Chemical Vapor Deposition (PECVD) process, every electrical connection, from RF power transmission to process gas control, directly impacts the uniformity of thin film deposition and chip yield. Facing the harsh environment of miniaturized equipment, high vacuum, and strong electromagnetic interference, WAGO picoMAX® connectors, with their three core advantages of "compactness, reliability, and efficiency," have become the ideal connection solution for PECVD systems.
Innovative Compact Design
Adapting to Precision Chamber Layouts
The internal space of PECVD equipment is limited, requiring dense arrangement of power, signal, and sensing lines around the reaction chamber. picoMAX® employs a single-spring, double-acting design, with multiple pin pitches of 3.5/5.0/7.5mm available. After mating, it occupies 30% less space than previous products, perfectly adapting to the wiring requirements around the chamber. Its hole-type connector is almost completely embedded in the pin header, supporting side-by-side assembly without loss of poles, significantly improving circuit board utilization and allowing for orderly arrangement of signal and power lines without interfering with the process gas flow field.
Robust Protection Against Extreme Operating Conditions
PECVD processes involve high vacuum, high-frequency plasma, and vibration environments, placing stringent demands on connector reliability. picoMAX® features a stable structure with up to 12g vibration resistance, preventing connection loosening caused by high-frequency vibration. It also incorporates an anti-misinsertion design and locking device, eliminating installation errors and preventing accidental disconnection, ensuring continuous equipment operation without downtime.
Tool-Free Quick Connection
picoMAX® features tool-free quick-connect technology, allowing for "plug-and-hold" connections for both single-strand and multi-strand wires with cold-pressed connectors. Complex wiring connections are completed in one step, significantly improving assembly efficiency and shortening debugging cycles. The modular design is compatible with reflow soldering processes, meeting the cost reduction needs of automated production. It also covers all PECVD connection scenarios: 3.5mm pin pitch accommodates 0.2-1.5mm² signal wires, while 5.0/7.5mm pin pitch supports 16A power lines. It supports wire-to-board and through-wall installation methods, is compatible with control cabinet and cavity wiring, and complies with GB/T 5226.1 electrical safety standards, building a solid defense for process stability.
In the semiconductor industry, where nanometer-level process precision is paramount, reliable connections are the guarantee of high yield. WAGO picoMAX®, with its revolutionary product design concept, achieves "small size, high performance" within a compact footprint, providing stable, efficient, and long-lasting connection solutions for PECVD equipment. This helps semiconductor manufacturers overcome the challenges of precision process connections, safeguarding the micrometer-level precision of every chip.
Post time: Mar-13-2026